152

S. Palleboina and K. Pallela

Fig. 11.4 Processing steps to design a bio-mimicking insect (dimensions are not quoted for various

reasons)

The author has developed a MEMS process for RF Switch using about 200

structures having various dimensions between 10 and 1000 microns length, 10–400

microns width and with a thickness of up to 3 microns.

Various types of electronic materials such as semiconductors, metals and polymers

have been used to optimize the process (Fig. 11.4).

The insect mimicked MAVs mostly need to consider the size and weight as a very

important focusing area. Designing a bird mimicking MAVs have the flexibility of

selecting range of dimensions in terms of size (2 cm to 4 m) and weight (5 g to 20 kg)

[6] (Fig. 11.5).

On the basis of previous knowledge on VLSI technology, MMIC technology and

RF MEMS technology over 3–4 decades, the new MEMS based MAV realization

technology and methodology is proposed which is promising for future applications.

The MAV realization consists of hybrid technology of Semiconductor VLSI, MMIC

and MEMS processes.

AninsectmimickingMAVwithawingbeatfrequencylessthan50cpsasestimated

for soapnut bug (T.j) by using wingloading techniques (N. Chari, personal Commu-

nication) can be proposed. The insertion of various control and sensory systems are

possible using MEMS technology and will be included at the final stage after forming

the wings. The power consumption for such MAVs will be in the range of 1–5 V.

However, for a controlled bio-mimicking MAV the power consumption may increase

to a range of approximately 10 V.

However, there are some of the open challenges identified in this technology at

various levels as given below:

• This technology is new to test the structures for On Line Process Control (OLPC)

to improve the MEMS process reliability

• The new electronic material or circuits must improve the mechanical properties

• Process optimization or realizing sticking micro mechanical structures